PoliEdge® Colloidal Silica
for Chemical and Mechanical Polishing
Colloidal silica based slurry formulations are gaining popularity in CMP steps in semiconductor chip manufacturing processes, due to
- Low defective rates and scratching
- Tighter particle size control
- Easier handling
Grace Davison has developed PoliEdge® colloidal silica specifically for CMP abrasive applications to meet the highest demands in quality and consistency.