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PoliEdge® Colloidal Silica
for Chemical and Mechanical Polishing

Colloidal silica based slurry formulations are gaining popularity in CMP steps in semiconductor chip manufacturing processes, due to

  • Low defective rates and scratching
  • Tighter particle size control
  • Easier handling

Grace Davison has developed PoliEdge® colloidal silica specifically for CMP abrasive applications to meet the highest demands in quality and consistency.

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